Ormet® PCB-701 is a lead-free conductive paste used to fill micro via structures that create z-axis interconnections between circuit layers in semiconductor packaging and printed circuit boards. Ormet® PCB-701 is used in via fill applications to increase yield and reduce product manufacturing time.

Aug 5, 2014 · HANNIBAL, Ohio - The Niagara World-Wide company announced July 31 the final and permanent closing of the former Ormet Primary Aluminum Corporation's plant near here.

Ormet® TLPS products combine the best features of solder and sintering solutions, making them a versatile platform for a wide range of applications. Key benefits include: Low-Temperature Processing: Forms metallurgical bonds at temperatures as low as 180°C.

Ormet® PCB-710 is a Pb-free paste formulated for filling microvias within printed circuit boards. Ormet® PCB-710 filling paste is designed for stacked vias to form vertical interconnects allowing PCB designers to maximize circuit density and minimize the number of lamination cycles required to manufacture high layer count PCB’s.

Ormet® produces highly reliable and environmentally friendly electronics for advanced semiconductor packages.

Feb 15, 2019 · Ormet PCB-710 is available in multiple jar and cartridge sizes. The Ormet PCB-710 is shipped in low-temperature containers and should be placed in cold storage (-10°C or below) immediately upon receipt.

Jul 17, 2018 · Ormet’s paste sinters at one temperature forming a new alloy with higher melting point; Paste interconnects allow for changing build sequence in which vias are formed i.e. drill, add paste, and then laminate - giving you interconnects inside a …

Ormet Corporation is a privately owned manufacturer of alumina and primary aluminum whose headquarters are located in Canonsburg, Pennsylvania. Ormet's specialty alumina materials are used in aluminum production as well as abrasives, refractories, ceramics, and electrical insulation as a fire retardant.

Ormet pastes eliminate complex drilling and plating processes, Production yield improvement by process steps reduction leading to improved yield compared to conventional build-up

completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics business of Merck KGaA, Darmstadt, Germany. This milestone represents a significant step forward in AIT’s strategic expansion in advanced material solutions for semiconductor packaging and assembly. By integrating Ormet’s