TO-247PLUS is a package family intended to be mounted using clips or pressure systems. The PLUS nomenclature after the three digit JEDEC’s code number 247, denotes the Infineon’s packages with no screwing hole. It includes the three terminals TO-247PLUS 3pin and the four terminals TO-247PLUS 4pin.
TO-247 - Toshiba Electronic Devices & Storage Corporation
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the dimensions and packing method for Toshiba Semiconductor's TO-247 package.
TO-247 4pin package - Infineon Technologies
With the 600 V CoolMOS™ P6 SJ MOSFET Infineon introduces an improved version of the standard TO-247 4-pin package. The TO-247 4-pin with asymmetric leads comes along with increased creepage distance between the critical leads and enables smoother wave soldering and reduced board yield loss.
TO-247 Datasheet(PDF) - STMicroelectronics
This device is an N-channel Power MOSFET based on MDmesh™ M5 innovative vertical process technology combined with the well-known PowerMESH™ horizontal layout. The resulting product offers extremely low onresistance, making it particularly suitable for applications requiring high power and superior efficiency. Aavid, Thermal Division...
Thyristors - TO-247 - Vishay Intertechnology
TO-247, Thyristors manufactured by Vishay, a global leader for semiconductors and passive electronic components.
Provides space advantage over conventional power packages with a thinner and smaller molded body package outline. Dissipates heat directly to an external heat sink through an exposed die attach pad on the back side of the package.
TO-247 | 臺灣東芝電子零組件股份有限公司 | 台灣
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the …
TO-247PLUS - Infineon Technologies
Highest current density up to 75 A 1200 V IGBT or 120 A 600 V IGBT copacked with a diode in TO-247 footprint, 20% lower R th(jh), 15% better heat dissipation, fast clip assembly.
TO-247 | 东芝半导体&存储产品中国官网
On this page you can find the dimensions and packing method for Toshiba Semiconductor's TO-247 package.
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TO-247AC
Center tap TO-247 package High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance Low forward voltage drop High frequency operation Guard ring for enhanced ruggedness and long term reliability Dimensions in millimeters and inches Conform to JEDEC outline TO-247AC (TO-3P) 2 BASE
Diodes and Rectifiers - Schottky - TO-247 - Vishay Intertechnology
TO-247, Schottky, Diodes and Rectifiers manufactured by Vishay, a global leader for semiconductors and passive electronic components.
TOLL及TO-247-4L封装的介绍详解； - 知乎专栏
随着MOSFET开关速度的加快，封装中的源级焊线产生的寄生电感，对开关速度产生不利的影响愈发严重，TO-247-4L封装，能够对栅极驱动的信号源端子进行Kelvin连接，从而减小封装中源极线的电感。 进一步提高整个系统的效率，使器件能够在较低的温度下工作。 采用TO-247-4L 这种Kelvin连接封装，有如下优点： 1、有助于提高MOSFET开关速度。 MOSFET导通时由于源级焊线产生的寄生电感的存在，会产生反向的感应电压，该电压降低了通过栅极和源极的电压。 导 …
Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and …
TO-247 - Toshiba Electronic Devices & Storage Corporation
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the dimensions and packing method for Toshiba Semiconductor's TO-247 package.
TO-247 | Ultrafast Recovery | Diodes and Rectifiers | Vishay
TO-247, Ultrafast Recovery, Diodes and Rectifiers manufactured by Vishay, a global leader for semiconductors and passive electronic components.
TPC - TO 247 STD - teamglac.com
Team Pacific Corporation (TPC) is a semiconductor assembly and test services company located in the Philippines. Majority of the products being assembled by TPC are power discrete packages (e.g., SOT-227, TO-247, TO-264 packages, etc.), power …
TO-247 Component Package - mbedded.ninja
Mar 16, 2021 · The TO-247 (Transistor Outline 247, JEDEC) is a family of large through-hole 3-leaded component packages commonly used for 3-leaded devices which dissipate a lot of thermal power, including BJTs and MOSFETs.
TO247-3-HCC is the latest high clearance and creepage package from Infineon, addressing applications where power conversion system is exposed to environmentally harsh conditions.
MOSFETs - TO-247AD and TO-247AC package - Vishay Intertechnology
TO-247AD and TO-247AC package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.
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