Ormet® PCB-701 is a lead-free conductive paste used to fill micro via structures that create z-axis interconnections between circuit layers in semiconductor packaging and printed circuit boards. …

Aug 5, 2014 · HANNIBAL, Ohio - The Niagara World-Wide company announced July 31 the final and permanent closing of the former Ormet Primary Aluminum Corporation's plant near here.

Ormet® TLPS products combine the best features of solder and sintering solutions, making them a versatile platform for a wide range of applications. Key benefits include: Low-Temperature …

Ormet® PCB-710 is a Pb-free paste formulated for filling microvias within printed circuit boards. Ormet® PCB-710 filling paste is designed for stacked vias to form vertical interconnects …

Ormet® produces highly reliable and environmentally friendly electronics for advanced semiconductor packages.

Feb 15, 2019 · Ormet PCB-710 is available in multiple jar and cartridge sizes. The Ormet PCB-710 is shipped in low-temperature containers and should be placed in cold storage (-10°C or …

Jul 17, 2018 · Ormet’s paste sinters at one temperature forming a new alloy with higher melting point; Paste interconnects allow for changing build sequence in which vias are formed i.e. drill, …

Ormet Corporation is a privately owned manufacturer of alumina and primary aluminum whose headquarters are located in Canonsburg, Pennsylvania. Ormet's specialty alumina materials …

Ormet pastes eliminate complex drilling and plating processes, Production yield improvement by process steps reduction leading to improved yield compared to conventional build-up

completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics business of Merck KGaA, Darmstadt, Germany. This milestone represents …