Sep 20, 2024 · Welcome to the Open Accelerator Infrastructure (OAI) subgroup. OAI group is mainly working on define the common infrastructure specification for various accelerator solutions, such as common form factor, universal baseboard etc.

Feb 23, 2022 · Figure 62 Reference Liquid Cooling Design for UBB. 1: Universal Base Board; 2: Host Interface Board; 3: Power Distribution Board; 4: Liquid Cooling Module. The cooling components and OAMs in the figure are just for concept

The UBB supports 8 OAM modules, but the board has been engineered to help comprehensive options of interconnecting fabrics and topologies, power domains, TDP [s, cooling solutions, and scale-out options.

Sep 27, 2019 · Inspur unveiled a number of new technologies at the Open Compute Project (OCP) Regional Summit in Amsterdam this week. Perhaps the most impactful of these over the next 24 months is the Open Accelerator Module (OAM) Universal Baseboard (UBB.) We are going to use OAM UBB to keep that shorter.

• OAM is an Open Accelerator Module supporting multiple suppliers • A multi-OAM, Universal Baseboard (UBB) supporting various Interconnect Topologies • Tray for sliding a collection of OAMs (different UBBs) • System Chassis, Power, and Cooling (different Trays) • System- and Rack-level Management (DC-SCM)

Nov 4, 2024 · 为了进一步促进OAI的生态建立， OCP-OAI 小组在OAM的基础上统一了AI加速卡基板OAI-UBB（Universal Baseboard）设计规范。 规范以8张OAM为一个整体，定义了8xOAM的Baseboard的主机接口、供电方式、散热方式、管理接口、卡间互连拓扑、Scale Out方式，这里就不展开了，感兴趣的朋友可以查阅相关资料。 OAM GPU举例：下图是AMD的八卡OAM的GPU产品，通过1卡到7卡互联最多可实现双向互联带宽896GB/s（计算方式是128GB/s乘以7），因 …

Open Accelerator Modules (OAMs) answer the call for optimized performance and agile response with adaptable hardware solutions that support demanding applications and extend the lifecycle of existing infrastructure, ultimately reducing the total cost of ownership.

• OAI-UBB provides Host interface and native Expansion capabilities for eight OAMs • OAI-Tray provides mechanical support to adapt various UBBs in 19” and 21” Chassis • Modular power distribution allows 12V, 48V, and AC distribution to the Chassis

adhering to an agreed-upon set of hardware design standards, such as Universal Baseboard (UBB), OCP Accelerator Modules (OAM), and PCI-E and platform-specific interfaces, IT administrators can choose the GPU architecture best suited for their HPC or AI workloads.

Disparate network architectures supported through OAM direct connect, delivering increased efficiency, flexibility and manageability. Features two OCP interconnect topologies: Hybrid Cube Mesh (HCM), Fully Connected (FC).