Feb 13, 2025 · Duiven, the Netherlands, February 13, 2025 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, will release its results for the fourth quarter and full year ended December 31, 2024, on Thursday February 20, 2025 at ...

Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy.

BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.

Feb 13, 2025 · Duiven, the Netherlands, February 13, 2025 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, will release its results for the fourth quarter and full year ended December 31, 2024, on Thursday February 20, 2025 at ...

Nov 14, 2024 · Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit our website at www.besi.com .

Besi’s patented Soft Solder Process Technologies, combined with the Esec 2100 SSI, help maintain a competitive edge in the market. Demonstrations and sample builds with your material can be done on a live machine in one of our labs.

Feb 18, 2025 · The share repurchases are part of a € 100 million share repurchase program announced on August 31, 2024. Details are available on our website at https://www.besi.com/investor-relations/share-repurchase-program/.

Besi's Hybrid Bonding platform utilizes cutting-edge cleanliness concepts and exceptional optical alignment techniques to achieve superior placement accuracy, ensuring manufacturers can produce high-density interconnects and facilitate 3D integration with remarkable efficiency.

AI, smart devices, and advanced packaging are reshaping the semiconductor landscape. At SEMICON China 2025, Besi presents its comprehensive range of assembly equipment, built to meet the highest demands of precision, scalability, and efficiency. Booth N364.

Join Besi at Productronica 2025 in Munich, Germany! Discover the latest advancements in electronics manufacturing at the world's leading trade fair for electronics development and production. Register now and be a part of the premier event for …