Feb 13, 2025 · Duiven, the Netherlands, February 13, 2025 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer …

Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, …

BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of …

Feb 13, 2025 · Duiven, the Netherlands, February 13, 2025 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer …

Nov 14, 2024 · Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY) and its headquarters are located in …

Besi’s patented Soft Solder Process Technologies, combined with the Esec 2100 SSI, help maintain a competitive edge in the market. Demonstrations and sample builds with your …

Besi's Hybrid Bonding platform utilizes cutting-edge cleanliness concepts and exceptional optical alignment techniques to achieve superior placement accuracy, ensuring manufacturers can …

Feb 18, 2025 · The share repurchases are part of a € 100 million share repurchase program announced on August 31, 2024. Details are available on our website at …

Events & Shows 25 Feb 2025 Goldman Sachs European Technology Conference. (virtual) Back to overview

AI, smart devices, and advanced packaging are reshaping the semiconductor landscape. At SEMICON China 2025, Besi presents its comprehensive range of assembly equipment, built …