and that even if customers switch from CoWoS-S to CoWoS-L, it does not mean that they are cutting orders. The overall production capacity of CoWoS-L is deemed still insufficient to meet the ...

Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new capacity in the ...

GLink-2.5D supports full range of TSMC 2.5D technologies (CoWoS-S/R/L, InFO_oS). The UCIe Consortium has set a vision of interoperability of chiplet interfaces. GUC's implementation of UCIe takes ...

Nvidia's high-end AI server, the GB200, is facing challenges due to technical bottlenecks and material supply issues. Industry sources report that key materials used for chip substrates are in ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...