E&R (E&R Engineering Corp.), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, ...

and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment ...

In the long run, we believe the ideal packaging solution will involve utilizing a full-scale wafer as a single packaged device ... as PIC warpage control are crucial for this Photonic Non-mold 2.5D ...

China's wafer foundry industry will generate US$13.22 billion in revenue in 2024, representing a 16% year-on-year growth, slightly exceeding the global growth rate of 14%. The revenue momentum of ...

By Gary Trust Lady Gaga and Bruno Mars’ “Die With a Smile” notches a fourth total and consecutive week at No. 1 on the Billboard Hot 100 songs chart. The ballad became Gaga’s sixth Hot 100 ...

E&R provides reliable, mass-production equipment for FOPLP processes, supporting panel sizes from 300 × 300 mm to 700 × 700 mm. Its solutions encompass laser marking, laser cutting, plasma ...

As many as 30% of people who have allergies have a mold allergy. Coming warmer temperatures in St. Louis will create perfect mold-growing conditions both indoors and outdoors, according to ...

TASC is our industry’s premier peer-to-peer automation stage where America’s shop leaders refine the art of metalworking and CNC machining. For conference speakers, it's also an opportunity to ...