Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing ...
Wolfspeed, Inc. , the global leader in silicon carbide technology, today announced the appointment of Robert Feurle as Chief Executive Officer (CEO), effective May 1, 2025, following a comprehensive ...
Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...
Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows ...
Upgrades to Keysight’s double-pulse test systems bring easier and even higher-accuracy measurement of dynamic characteristics ...
OpenLight Announces Sample Availability of its First 1.6Tb DR8 DFB-based Photonic Integrated Circuit
Samples are available now, with bare die available immediately and an evaluation board including a integrated flip-chip 1.6Tb ...
The president and his Silicon Valley oligarch pals want to bring back the bad old “company towns” of yesteryear with a fresh ...
Blueprint peddles supplements and testing kits tied to his regimen, branding him a trailblazer in the anti-aging game. But ...
Tech meets longevity as biohackers learn how to cheat death by obsessively measuring — and optimizing — their vital signs.
HBM technology continues its relentless march in 2025 with the imminent arrival of more advanced HBM4 memory devices.
Power device makers roll out their latest advances at APEC 2025, targeting a range of applications from AI data centers to ...
A new type of micro-gas chromatography column was fabricated using direct metal laser sintering (DMLS) to circumvent ...
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