Below is a detailed analysis of the consumer semiconductor market covering consumer electronics such as televisions, gaming consoles, wearable devices, smart home appliances, cameras, audio equipment, ...

Tower Semiconductor has used OpenLight Photonics' 200G heterogeneous modulator design IP to demonstrate 400G/lane modulator on Tower’s commercially available, integrated silicon photonics platform, ...

With Intel getting ready to take on TSMC with its 18 A chip making capability and a new CEO Lip Bu Tan, Intel has built team of external vendors called Intel Foundry Accelerator - Design Services ...

In recent years semiconductor research papers prominently featured several key subjects driven by technological advancements and industry demands. Generative AI and high-performance computing (HPC) ...

Cadence has announced launch of AI powered EDA tool-suite Conformal AI Studio to address the Semiconductor chip design industry requirement of higher productivity and quick turnout of complex designs ...

Global semiconductor fab equipment spending for front-end facilities heading for a massive 18% growth in 2026 to reach US$130 Billion, and with a modest growth of 2% in 2025 to reach US$110 Billion, ...

RF and Opto semiconductor device specialist MACOM Announced introduction of high power capable new optical amplifier devices to amplify light signals so that they are powerful enough to travel longer ...

NVIDIA’s GTC 2025 conference kicked off this week, spotlighting the latest advancements in artificial intelligence (AI) and semiconductor technology. From groundbreaking GPU architectures to visionary ...

While the global semiconductor sales generated a revenue around $620-630 billion in 2024, an increase of close to 20% compared to the 2023, that was mainly due to HBM memory and AI processor and to ...

Lam Research announces industry's first Molybdenum deposition tool ALTUS Halo for high-volume chip production overcoming limitations of metals such as Tungsten which has replaced Copper to enable chip ...

Open Compute Project Foundation (OCP) and JEDEC Solid State Technology Association announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, ...

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