Semiconductor Engineering11h
TSMC’s Plan For Closing The Communication Gap
TSMC held its North American Open Innovation Platform (OIP) Ecosystem Forum at the Santa Clara County Convention Center on ...
Semiconductor Engineering11h
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal ...
Semiconductor Engineering1d
Working With Chiplets
The path forward is now heterogeneous chiplets targeted at specific markets, and while logic will continue to scale, other ...
Semiconductor Engineering2d
Research Bits: Oct. 1
Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep ...
Semiconductor Engineering3d
Data Routing In Heterogeneous Chip Designs
Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and ...
Semiconductor Engineering3d
Barriers To Chiplet Sockets
Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time ...
Semiconductor Engineering3d
Corner-Case Bug Hunting for RISC-V
RISC-V continues to make headlines worldwide, but verification continues to be challenging. The findings of the Wilson Research Report, 2022 (see figure 1) make the trends in verification clear. We ...
Semiconductor Engineering5d
Fine-Grained Functional Partitioning For Low Level SRAM Cache in 3D-IC designs (imec)
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
Semiconductor Engineering5d
Memristors: Flexible Behavioral Model ( Israel Institute of Technology)
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
Semiconductor Engineering6d
Novel NorthPole Architecture Enables Low-Latency, High-Energy-Efficiency LLM inference (IBM Research)
A new technical paper titled “Breakthrough low-latency, high-energy-efficiency LLM inference performance using NorthPole” was published by researchers at IBM Research. At the IEEE High Performance ...