Semiconductor Engineering9h
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal ...
Semiconductor Engineering9h
TSMC’s Plan For Closing The Communication Gap
TSMC held its North American Open Innovation Platform (OIP) Ecosystem Forum at the Santa Clara County Convention Center on ...
Semiconductor Engineering1d
Working With Chiplets
The path forward is now heterogeneous chiplets targeted at specific markets, and while logic will continue to scale, other ...
Semiconductor Engineering2d
Research Bits: Oct. 1
Rust-resistant coating for 2D semiconductors; polymeric material for data storage and encryption; quantum-secure deep ...
Semiconductor Engineering3d
Data Routing In Heterogeneous Chip Designs
Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and ...
Semiconductor Engineering5d
Fine-Grained Functional Partitioning For Low Level SRAM Cache in 3D-IC designs (imec)
A new technical paper titled “Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs” was ...
Semiconductor Engineering6d
Dualtronics: Photonic Devices on the Cation Face and Electronic Devices on the Anion Face of the Same Wafer
A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by ...
Semiconductor Engineering6d
Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference” was ...
Semiconductor Engineering5d
Memristors: Flexible Behavioral Model ( Israel Institute of Technology)
A Compact Behavioral Model for Volatile Memristors” was published by researchers at Technion – Israel Institute of Technology ...
Semiconductor Engineering3d
Barriers To Chiplet Sockets
Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come ...
Semiconductor Engineering6d
Novel NorthPole Architecture Enables Low-Latency, High-Energy-Efficiency LLM inference (IBM Research)
A new technical paper titled “Breakthrough low-latency, high-energy-efficiency LLM inference performance using NorthPole” was published by researchers at IBM Research. At the IEEE High Performance ...