Ryzen 5 7400F uses thermal paste instead of solder, chip hits max temps at stock TDP
AMD's new Ryzen 5 7400F uses normal thermal grease instead of STIM, which is shown to significantly impact thermals.
14 Reasons to Wait for the iPhone 17
Apple's iPhone development roadmap runs several years into the future and the company is continually working with suppliers ...
itc.ua8d
AMD applied thermal paste under the lid of Ryzen 5 7400F instead of solder — processor heats up to maximum with regular TDP
At a time when NVIDIA uses liquid metal in video cardsAMD saves solder and coats the processor crystals with thermal paste.
Semiconductor Engineering8d
Potential of Wireless Interconnects For Improving Performance And Flexibility Of Multi-Chip AI Accelerators
A new technical paper titled “Exploring the Potential of Wireless-enabled Multi-Chip AI Accelerators” was published by researchers at Universitat Politecnica de Catalunya. Abstract “The insatiable ...
Yahoo Finance11d
Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
WQ9201 2x2 MIMO Wi-Fi 6+BT combo chip targets consumer electronics products featuring fast data transmission, such as smartphones, tablets, PCs, TVs, and set-top-boxes ROCKVILLE, Md., Feb. 5 ...
Morningstar11d
Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
WQ9201 2x2 MIMO Wi-Fi 6+BT combo chip targets consumer electronics products featuring fast data transmission, such as smartphones, tablets, PCs, TVs, and set-top-boxes The Ceva-Waves Wi-Fi 6 IP ...
Digi Times3d
MediaTek, Realtek see 2025 network chip boom as Wi-Fi 7 gains traction
MediaTek set to capture greater market share as Wi-Fi 7 gains traction in 2025 iPhone 16 series to drive Wi-Fi 7 adoption, benefiting chip makers in 2025 Wi-Fi 7 expected to take flight in late ...