Semiconductor Engineering6d
The Rise Of Thin Wafer Processing
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...
Hosted on MSN11mon
TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips
Meanwhile, it may also make sense to stack additional logic on wafer-scale processors to optimize costs. Wafer-scale processors in general (i.e., Cerebras's WSE), and InFO_SoW-based processors in ...
Overcoming stacking constraints in hexagonal boron nitride via metal-organic chemical vapor deposition
Researchers from Pohang University of Science and Technology (POSTECH) and the University of Montpellier have successfully ...
AZoNano13y
SB6/8e Semi-Automated Wafer Bonding System from SÜSS MicroTec AG
A wafer stack loading arm simplifies the loading and unloading of aligned wafers into the vacuum system. Combined with the SUSS Bond aligner BA6 or BA8 the SB6e & SB8e provides superior post bond ...
EurekAlert!7d
Overcoming stacking constraints in hexagonal boron nitride via metal-organic chemical vapor deposition
This step-edge guided growth mechanism enabled the formation of high-quality, wafer-scale AA-stacked hBN films, ensuring both structural uniformity and crystallinity required for practical ...