Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...

Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

The Advanced Backend Solutions segment develops and sells Imaging Systems, Coating Systems, and Bonding Systems used in advanced packaging, wafer-level manufacturing, and 3D integration processes ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Applied and Besi have extended their agreement, to co-develop the industry’s first fully integrated equipment solution for ...

Researchers have now developed a new hardware platform for AI accelerators capable of handling significant workloads with ...

A cutting-edge AI acceleration platform powered by light rather than electricity could revolutionize how AI is trained and ...

The emergence of AI has profoundly transformed numerous industries. Driven by deep learning technology and Big Data, AI ...

In October last year, Baiao Chemical invested 700 million yuan in cash to increase its capital and take control of Suzhou CoreWisdom Semiconductor Technology Co., Ltd. ("CoreWisdom"), while also ...