The Advanced Backend Solutions segment develops and sells Imaging Systems, Coating Systems, and Bonding Systems used in advanced packaging, wafer-level manufacturing, and 3D integration processes ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Applied and Besi have extended their agreement, to co-develop the industry’s first fully integrated equipment solution for ...

In October last year, Baiao Chemical invested 700 million yuan in cash to increase its capital and take control of Suzhou CoreWisdom Semiconductor Technology Co., Ltd. ("CoreWisdom"), while also ...

E&R ensures top-tier quality through MIT manufacturing, integrating key components from leading European and US suppliers for ...

Good morning, good afternoon, ladies and gentlemen, and welcome to Besi Quarterly Conference Call and Audio Webcast to discuss the company's 2025 first quarter results. You can register for the ...

Despite a slight revenue dip, BESIY sees order growth and strong cash flow, while preparing for future advancements in hybrid ...

JCET is dedicated to pioneering advanced packaging technologies and fostering collaborative development across the industry chain. In 2024, R&D expenditures reached RMB 1.72 billion, an increase of 19 ...