AI-powered applications reshaped the electronics manufacturing landscape in 2024, driving a resurgence for Taiwan’s leading IC substrate makers. Unimicron, Kinsus, and Zhen Ding Tech (ZDT) posted ...

SANTA CLARA, Calif., Feb. 7, 2025 /PRNewswire/ -- LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a ...

A new high-end production site for IC substrates is currently being established in Malaysia (Kulim). In Leoben, a European competence center including series production for IC substrate ...

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

The Japanese AIST Group (consisting of National Institute of Advanced Industrial Science and Technology and AIST Solutions) and NGK Insulators have embarked on joint research to validate methods for ...

Brewer Science’s new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties in advanced packaging. January 23rd, 2025 - By: Laura Peters And Ed ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation ...

New Analysis Of ABF (Ajinomoto Build-up Film) Substrate Market overview, spend analysis, imports, segmentation, key players and opportunity analysis 2025-2032. The study also includes an in-depth ...