Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting ... Semi Additive Process (SAP) SAP is used for flip chip substrates that use ABF ...

An FCBGA substrate is a type of semiconductor packaging that employs Flip Chip technology to mount an integrated circuit (IC) directly onto the substrate ... include BT resin and Ajinomoto Build-up ...

Austria-based AT&S AG, a major player in the PCB and IC substrate industry, has announced the establishment of a new Information Technology Shared Service Centre (IT ...