TeraSignal, a leader in intelligent interconnect technology, announced the successful interoperability demonstration between its TSLink intelligent chip-to-module (C2M) interconnect and Synopsys' 112G ...

The collaboration simplifies the deployment of Linear Pluggable Optics (LPO), Near Package Optics (NPO), and Co-Packaged Optics (CPO) by leveraging TSLink's advanced link training and diagnostics ...

IRVINE, Calif., Jan. 27, 2025 /PRNewswire/ -- DesignCon 2025 – TeraSignal, a leader in intelligent interconnect technology, announced the successful interoperability demonstration between its ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Fraunhofer’s Andy Heinig explains how ...

Co-packaged optics (CPO)—the silicon photonics technology promising to transform modern data centers and high-performance networks by addressing critical challenges like bandwidth density, energy ...

In 2022, the global Co-Packaged Optics Module (CPO) market was valued at US$ million. It is projected to reach US$ million by 2029, growing at a CAGR of % during the forecast period. The market for Co ...

XPUs with integrated Co-Packaged Optics (CPO) enhance AI server performance by increasing XPU density from tens within a rack to hundreds across multiple racks. Marvell CPO leverages multiple ...

"Integrating co-packaged optics into custom XPUs is the logical next step to scale performance with higher interconnect bandwidths and longer reach." "Silicon photonics is vital for scaling ...