TSMC’s CoWoS packaging triples capacity by 2025, enhancing AI chip efficiency and capturing high-margin revenue. While competitors struggle, TSMC is accelerating to 2nm production, securing its ...

"As we move into Blackwell, we will use largely CoWoS-L. Of course, we're still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L," Huang ...

GLink-2.5D supports full range of TSMC 2.5D technologies (CoWoS-S/R/L, InFO_oS). The UCIe Consortium has set a vision of interoperability of chiplet interfaces. GUC's implementation of UCIe takes ...

Nvidia's high-end AI server, the GB200, is facing challenges due to technical bottlenecks and material supply issues. Industry sources report that key materials used for chip substrates are in ...

This milestone was achieved using TSMC's advanced N3P process and CoWoS packaging technologies, targeting AI, high-performance computing (HPC), xPU, and networking applications. In this test chip ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...