Researchers from Pohang University of Science and Technology (POSTECH) and the University of Montpellier have successfully ...

Pohang University and University of Montpellier researchers synthesize AA-stacked hBN, revealing novel stacking control ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

TSMC already makes a system-on-wafer design for Tesla, but will expand it to 3D-stacked HBM memory with a future CoWoS version. Credit: TSMC As Tom's Hardware notes, System-on-Wafer is essentially ...

A wafer stack loading arm simplifies the loading and unloading of aligned wafers into the vacuum system. Combined with the SUSS Bond aligner BA6 or BA8 the SB6e & SB8e provides superior post bond ...

A breakthrough in next-generation semiconductor technology has been announced by Chinese researchers, with the creation of the world’s largest N-polar gallium nitride (GaN) wafer, at eight ...

“True 3D is wafers stacked on top of each other in a highly integrated way. The second group would be 3D system-on-chip (SoC) integration, where you might have a backside power distribution layer, or ...

This step-edge guided growth mechanism enabled the formation of high-quality, wafer-scale AA-stacked hBN films, ensuring both structural uniformity and crystallinity required for practical ...