Many of will have marveled at the feats of reverse engineering achieved by decapping integrated circuits and decoding their secrets by examining the raw silicon die. Few of us will have a go for ...

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on the silicon die, which is what researchers from IMEC now have done (preprint). Using standard processes and ...

All major foundries have adopted the programmable electrical rule checker (PERC) as the pre-silicon electrostatic discharge (ESD) signoff tool for IP and chip designs. This concept of rule checking ...

IP can be packaged in different ways, including soft IP (software), hard IP (physical layout), and even as “chiplets,” individual silicon die that deliver the IP function. The revenue, according to ...

In a conventional system deploying real wires on a single silicon die items 2, 3 & 4 are not usually considered an issue. Delay (latency) even for a single wire or set of wires transversing much of ...

Inc via Getty Images Tech titans stand with Donald Trump to kill off activism in Silicon Valley on x (opens in a new window) Tech titans stand with Donald Trump to kill off activism in Silicon ...

over heterogeneous wafer- and die-bonding technologies and eventually direct epitaxial growth in the longer term," states Joris Van Campenhout, fellow silicon photonics and director of the ...

The silicon IP includes high-speed 3D I/O for vertically stacking die inside chiplets. Given a projected 45% TAM growth annually, custom silicon is expected to account for approximately 25% of the ...