Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...

Naturally, it’s far easier and cheaper if a GaAs laser can be grown directly on the silicon die, which is what researchers from IMEC now have done (preprint). Using standard processes and ...

Many of will have marveled at the feats of reverse engineering achieved by decapping integrated circuits and decoding their secrets by examining the raw silicon die. Few of us will have a go for ...

All major foundries have adopted the programmable electrical rule checker (PERC) as the pre-silicon electrostatic discharge (ESD) signoff tool for IP and chip designs. This concept of rule checking ...

IP can be packaged in different ways, including soft IP (software), hard IP (physical layout), and even as “chiplets,” individual silicon die that deliver the IP function. The revenue, according to ...

Marvell Technology has demonstrated its first 2-nm silicon IP, enhancing the performance and efficiency of AI and cloud ...

It’s purely back end of line processing. You are adding three, four, five metal layers to that silicon. That’s what we call a passive interposer. It’s just creating that die-to-die interconnect. But ...

over heterogeneous wafer- and die-bonding technologies and eventually direct epitaxial growth in the longer term," states Joris Van Campenhout, fellow silicon photonics and director of the ...

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, has demonstrated its first 2nm silicon IP for next-generation AI and cloud infrastructure. Produced on ...