Through via hole fabrication process by deep reactive-ion etching (DRIE): (a) Sample cleaning; (b) Deposition of mask material; (c) Transfer of desired pattern; (d) Desired pattern achieved; (e) ...

Previous photolithography technologies used transmissive masks protected by a pellicle. For EUV lithography, however, the masks must be reflective and cannot have a protective pellicle as this ...

An image of a mask containing the structure of an integrated ... a disk measuring 300 mm in diameter. Interestingly, DUV lithography at a wavelength of 193 nm has dominated the field much longer ...