Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting ... Semi Additive Process (SAP) SAP is used for flip chip substrates that use ABF ...

These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter ...

Tuesday 7 January 2025 Ibiden's exclusive position in AI chip substrate market rooted in deep ties with Intel Japanese manufacturer Ibiden has established itself as a dominant player in the IC ...