SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

There are currently three ways of Cu-Cu hybrid bonding (see the benchmarking table below). Wafer to Wafer (W2W) process is the most commonly used, whereas die-to-wafer (D2W) or chip to wafer (C2W) ...

The brief was that the wafer probe yield ... sawn (or ‘singulated’) die will be glued to a lead frame (a metallic scaffold) before gold (or copper, lately) bond wires are attached between ...

For instance, in June 2022, Intel and CEA-Leti optimized a hybrid direct-bonding, self-assembly process for D2W (Die-to-Wafer) bonding that has the potential to increase the alignment accuracy as ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...