(the typical thickness of the wiring in today's chips is about 10nm–30nm). This improvement is because NbP is a material with ...

Stanford University researchers have unveiled a material—niobium phosphide—that could revolutionize chip design by dramatically reducing energy loss in ultra-thin interconnects.

Advanced Chip and Circuit Materials Introduces CeleritasSF & CeleritasBU Products for Ultra-High-Speed, Buildup, and UHDI Printed Circuit Boards Advanced Chip and Circuit Materials Inc. (ACCM), a ...