Hardware data aggregator, momomo_us on X, has shared the box packaging of Intel's Arrow Lake non-K processors, expected to launch next month. The bulky design suggests the inclusion of a stock ...

Qualcomm might be testing Snapdragon X2 Elite with 18-core CPU and 64GB RAM as it targets high-end Windows on ARM laptops.

Prototype microchannel cooler targets 1,000W heat  Troubled Chipzilla is playing with water again, this time showing off an ...

Intel's first to feature memory on the CPU package similar to how Apple's M-series chips are designed. Surprisingly, Gelsinger said that the design will not reappear on any future Intel CPUs.

That effort, allegedly codenamed "Project Glymur" would no doubt benefit from a CPU with even higher core counts. The new chip is further said to implement SiP or System in Package technology ...

Shifting to a chiplet-based design can lower manufacturing costs ... that can be combined to create a larger, more powerful processor package. In simple terms, this new approach allows companies ...

One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates all the components within a single package. This includes both CPU ...